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TDA8932B Datasheet, PDF (17/48 Pages) NXP Semiconductors – Class-D audio amplifier
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NXP Semiconductors
TDA8932B
Class-D audio amplifier
Table 9. Thermal characteristics …continued
Symbol Parameter
Conditions
HTSSOP32 package
Rth(j-a)
thermal resistance from junction free air natural convection
to ambient
JEDEC test board
2 layer application board
Ψj-lead
thermal characterization
parameter from junction to lead
Ψj-top
thermal characterization
parameter from junction to top of
package
Rth(j-c)
thermal resistance from junction free air natural convection
to case
Min Typ Max
[1] -
[4] -
-
[3] -
-
47
50
48
-
-
30
-
2
4.0
-
[1] Measured on a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection.
[2] Two layer application board (55 mm × 45 mm), 35 µm copper, FR4 base material in free air with natural convection.
[3] Strongly depends on where the measurement is taken on the package.
[4] Two layer application board (55 mm × 40 mm), 35 µm copper, FR4 base material in free air with natural convection.
12. Static characteristics
Unit
K/W
K/W
K/W
K/W
K/W
Table 10. Static characteristics
VP = 22 V; fosc = 320 kHz; Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Supply
VP
supply voltage
asymmetrical supply
symmetrical supply
IP
Iq(tot)
supply current
total quiescent current
Sleep mode; no load
Operating mode; no load, no
snubbers and no filter connected
Series resistance output power switches
RDSon
drain-source on-state
resistance
Power-up input: pin POWERUP[1]
Tj = 25 °C
Tj = 125 °C
VI
input voltage
II
input current
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
Engage input: pin ENGAGE[1]
VI = 3 V
VO
output voltage
open pin
VI
input voltage
IO
output current
VI = 0 V
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
Min
Typ
Max Unit
10
22
36
V
±5
±11
±18
V
-
145
195
µA
-
40
50
mA
-
150
-
mΩ
-
234
-
mΩ
0
-
6.0
V
-
1
20
µA
0
-
0.8
V
2
-
6.0
V
2.4
2.8
3.1
V
0
-
6.0
V
-
50
60
µA
0
-
0.8
V
2.4
-
6.0
V
TDA8932B_4
Product data sheet
Rev. 04 — 18 December 2008
© NXP B.V. 2008. All rights reserved.
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