SA58631 Datasheet, PDF (15/21 Pages) NXP Semiconductors – 3 W BTL audio amplifier

NXP Semiconductors
15. Package outline
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 4 x 4 x 0.85 mm
SA58631
3 W BTL audio amplifier
SOT909-1
X
D
BA
0
1
2 mm
scale
terminal 1
index area
terminal 1
index area
L
e₁
e
1
b
4
E
A
A₁
c
detail X
vM CA B
wM C
y₁ C
C
y
exposed tie bar (4×)
E_h
8
5
D_h
DIMENSIONS (mm are the original dimensions)
UNIT ^A(1)
max.
A1
b
c
D⁽¹⁾ Dh E⁽¹⁾ Eh
e
mm
1
0.05
0.00
0.4
0.3
0.2
4.1
3.9
3.25
2.95
4.1 2.35
3.9 2.05
0.8
e1
L
2.4
0.65
0.40
v
wy
y1
0.1 0.05 0.05 0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT909-1
MO-229
ISSUE DATE
05-09-26
05-09-28
Fig 22. Package outline SOT909-1 (HVSON8)
SA58631_2
Product data sheet
Rev. 02 — 12 October 2007
© NXP B.V. 2007. All rights reserved.
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