DAC1003D160 Datasheet, PDF (15/19 Pages) NXP Semiconductors – Dual 10 bits DAC, up to 160 MHz, 2 x interpolation

NXP Semiconductors
DAC1003D160
Dual 10 bits DAC, up to 160 MHz, 2 x interpolation
12. Package outline
HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad
SOT841-1
y
exposed die pad
D_h
60
61
c
X
A
41
40 ZE
E_h
80
1
pin 1 index
wM
e
b_p
D
H_D
e
wM
b_p
E H_E
A ^A2
A₁
21
20
Z_D
vM A
B
vM B
detail X
(A ₃)
θ
L_p
L
0
5
10 mm
DIMENSIONS (mm are the original dimensions)
scale
UNIT
A
max
A₁
A₂
A₃
b_p
c D⁽¹⁾ D_h E⁽¹⁾ E_h
e
H_D H_E
L
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
12.1
11.9
6.05
5.95
12.1
11.9
6.05
5.95
0.5
14.15 14.15
13.85 13.85
1
L_p v
w
y Z_D(1) Z_E(1) θ
0.75
0.45
0.2
0.08
0.1
1.45 1.45
1.05 1.05
7^°
0^°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
SOT841-1
MS-026
04-01-15
Fig 11. Package outline SOT841-1 (HTQFP80)
DAC1003D160_2
Product data sheet
Rev. 02 — 13 August 2008
© NXP B.V. 2008. All rights reserved.
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