BGU7005 Datasheet, PDF (15/18 Pages) NXP Semiconductors – SiGe:C Low Noise Amplifier MMIC for GPS

NXP Semiconductors
BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
9. Package outline
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
b
1
2
3
4×
L₁
L
(2)
e
SOT886
6
5
4
e₁
e₁
6×
A
(2)
A₁
D
E
terminal 1
index area
0
1
DIMENSIONS (mm are the original dimensions)
scale
UNIT
A ⁽¹⁾
max
A₁
max
b
D
E
e
mm
0.5
0.04
0.25
0.17
1.5
1.4
1.05
0.95
0.6
e₁
L
L₁
0.5
0.35 0.40
0.27 0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT886
MO-252
Fig 32. Package outline SOT886 (XSON6)
BGU7005_1
Preliminary data sheet
Rev. 01 — 28 October 2009
2 mm
EUROPEAN
PROJECTION
ISSUE DATE
04-07-15
04-07-22
© NXP B.V. 2009. All rights reserved.
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