BAS40_13 Datasheet, PDF (14/21 Pages) Micro Commercial Components – Surface Mount Schottky Barrier Diode 200 mWatt Tape & Reel EIA Standard 481.

NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
4.4
4
2.9
1.6
2.1 1.6
1.1 1.2
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
R = 0.05 (8×)
1.30
0.30
solder lands
solder resist
solder paste
occupied area
R = 0.05 (8×)
0.90
0.60 0.70 0.80
(2×) (2×) (2×)
solder lands
0.30
(2×)
solder paste
0.40
(2×)
solder resist
0.50
(2×)
occupied area
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering footprint SOD882
mbl872
BAS40_1PSXXSB4X_SER_8
Product data sheet
Rev. 08 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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