PCA9522 Datasheet, PDF (12/20 Pages) NXP Semiconductors – Fast dual bidirectional bus buffer with hot insertion logic

NXP Semiconductors
PCA9522
Fast dual bidirectional bus buffer with hot insertion logic
11. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
y
Z
8
c
5
E
A
X
H_E
vM A
pin 1 index
1
e
A₂
A₁
4
b_p
wM
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT _max. A₁
A₂
A₃
b_p
c
D⁽¹⁾ E⁽²⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8^o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0^o
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT96-1
IEC
076E03
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 11. Package outline SOT96-1 (SO8)
PCA9522
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 September 2011
© NXP B.V. 2011. All rights reserved.
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