TJA1040TD-T Datasheet, PDF (11/17 Pages) NXP Semiconductors – High speed CAN transceiver

Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1040
BONDING PAD LOCATIONS
SYMBOL
TXD
GND
V_CC
RXD
SPLIT
CANL
CANH
STB
PAD
1
2
3
4
5
6
7
8
COORDINATES⁽¹⁾
x
y
119.5
648.5
1 214.25
1 635.25
1 516.5
990.5
530.25
113.75
114.5
85
114.5
114.5
1 275
1 273.75
1 273.75
1 246
Note
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
handbook, halfpage ⁸
7
6
5
TJA1040U
test pad 1
test pad 2
x
0₁
0
2
3
4
MBL584
y
The backside of the bare die must be connected to ground.
Fig.9 Bonding pad locations.
2003 Oct 14
11