PBSS303PX Datasheet, PDF (11/15 Pages) NXP Semiconductors – 30 V, 5.1 A PNP low VCEsat (BISS) transistor

NXP Semiconductors
11. Soldering
PBSS303PX
30 V, 5.1 A PNP low V_CEsat (BISS) transistor
0.85 0.20
1.20
4.60
1.20
4.75
2.25
2.00
1.90
1.20
1.70
4.85
0.50
1.20
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
1.00
(3x)
3
2
1
0.60 (3x)
0.70 (3x)
3.70
3.95
Fig 16. Reflow soldering footprint SOT89 (SC-62)
6.60
2.40
msa442
2
3.50
7.60
0.50
solder lands
3
1
1.20
solder resist
3.00
occupied area
Dimensions in mm
preferred transport direction during soldering
1.50
0.70
5.30
Not recommended for wave soldering
Fig 17. Wave soldering footprint SOT89 (SC-62)
msa423
PBSS303PX_2
Product data sheet
Rev. 02 — 20 November 2009
© NXP B.V. 2009. All rights reserved.
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