74AUP1G332 Datasheet, PDF (11/16 Pages) NXP Semiconductors – Low-power 3-input OR gate

NXP Semiconductors
13. Package outline
Plastic surface-mounted package; 6 leads
D
B
74AUP1G332
Low-power 3-input OR gate
SOT363
E
A
X
y
6
5
4
pin 1
index
1
2
e1
bp
e
3
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e₁
HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35 _1.3
1.15
0.65
2.2 0.45 0.25
2.0 0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
IEC
SOT363
REFERENCES
JEDEC
JEITA
SC-88
Fig 9. Package outline SOT363 (SC-88)
74AUP1G332_2
Product data sheet
Rev. 02 — 29 February 2008
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
© NXP B.V. 2008. All rights reserved.
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