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PESD1LIN Datasheet, PDF (1/11 Pages) NXP Semiconductors – LIN bus ESD protection diode in SOD323
PESD1LIN
LIN bus ESD protection diode
Rev. 02 — 12 November 2008
Product data sheet
1. Product profile
1.1 General description
PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic
package designed to protect one automotive Local Interconnect Network (LIN) bus line
from the damage caused by ElectroStatic Discharge (ESD) and other transients.
1.2 Features
I ESD protection of one automotive LIN bus line
I Asymmetrical diode configuration ensures an optimized ElectroMagnetic
Immunity (EMI) of a LIN Electronic Control Unit (ECU)
I Due to the integrated diode structure only one very small SOD323 package is needed
I Max. peak pulse power: PPP = 160 W at tp = 8/20 µs
I Low clamping voltage: VCL = 40 V at IPP = 1 A
I Ultra low leakage current: IRM < 1 nA
I ESD protection of up to 23 kV
I IEC 61000-4-2, level 4 (ESD)
I IEC 61000-4-5 (surge); IPP = 3 A at tp = 8/20 µs
1.3 Applications
I LIN bus protection
I Automotive applications
1.4 Quick reference data
Table 1. Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
VRWM
reverse standoff voltage
PESD1LIN (15 V)
PESD1LIN (24 V)
Cd
diode capacitance
Conditions
VR = 0 V;
f = 1 MHz
Min Typ Max Unit
-
-
15
V
-
-
24
V
-
13
17
pF