MF1ICS2005 Datasheet, PDF (1/7 Pages) NXP Semiconductors – Sawn bumped 120μm wafer addendum

MF1 IC S20 05
Sawn bumped 120µm wafer addendum
Rev. 3.0 — 18 July 2007
141130
Product data sheet
PUBLIC
1. General description
The MF1 IC S20 05 is a contactless Smart Card IC designed for card IC coils following the
“Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader
environment, which is built according to NXP´ specification.
This specification describes electrical, physical and dimensional properties of wafers.
2. Ordering information
Table 1. Ordering information
Type number
Package
Name
MF1ICS2005W/U7D
Description
Die on sawn wafer
Ordering Code
9352 851 56005
3. Mechanical specification
3.1 Wafer
• Diameter:
• Thickness:
• Flatness:
• PGDW:
3.2 Wafer backside
• Material:
• Treatment:
3.3 Chip dimensions
• Chip size:
• Scribe lines:
3.4 Passivation
• Type:
• Material:
8”
120 µm ± 15 µm
not applicable
24892
Si
ground and stress relieve
1.11 x 1.06 mm
x-line: 80 µm
y-line: 80 µm
sandwich structure
PSG / Nitride