IP4855CX25 Datasheet, PDF (1/29 Pages) NXP Semiconductors – SD 3.0-compliant memory card integrated voltage level translator with EMI filter and ESD protection

IP4855CX25
SD 3.0-compliant memory card integrated voltage level
translator with EMI filter and ESD protection
Rev. 1 — 13 September 2012
Product data sheet
1. General description
The device is an SD 3.0-compliant 6-bit bidirectional dual voltage level translator. It is
designed to interface between a memory card operating at 1.8 V or 2.9 V signal levels and
a host with a fixed nominal supply voltage of 1.2 V to 3.3 V. The device supports SD 3.0
SDR50, DDR50, SDR25, SDR12 and SD 2.0 High-Speed (50 MHz) and Default-Speed
(25 MHz) modes. The device has an integrated switchable voltage regulator to supply the
card-side I/Os, built-in EMI filters and robust ESD protections (IEC 61000-4-2, level 4).
2. Features and benefits
 Supports up to 100 MHz clock rate
 Feedback channel for clock synchronization
 SD 3.0 specification-compliant voltage translation to support SDR50, DDR50, SDR25,
SDR12, High-Speed and Default-Speed modes
 Low dropout voltage regulator to supply the card-side I/Os
 Low power consumption by push-pull output stage with break-before-make
architecture
 Integrated pull-up and pull-down resistors: no external resistors required
 Integrated EMI filters suppress higher harmonics of digital I/Os
 Integrated 8 kV ESD protection according to IEC 61000-4-2, level 4 on card side
 Level shifting buffers keep ESD stress away from the host (zero-clamping concept)
 Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
 25-ball WLCSP; pitch 0.4 mm
3. Applications
SD, MMC or microSD memory card interfaces in portable electronic applications
supporting different interface voltage modes of the SD 3.0 specification, such as mobile
and smart phone, digital camera and card reader in (laptop) computer.
4. Ordering information
Table 1. Ordering information
Type number Package
Name
Description
Version
IP4855CX25/P WLCSP25 wafer level chip-size package; 25 bumps (5  5) IP4855CX25
[1] Size 2.04  2.04  0.5 mm