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NTR2101P Datasheet, PDF (1/5 Pages) ON Semiconductor – Small Signal MOSFET
NTR2101P
Small Signal MOSFET
−8.0 V, −3.7 A, Single P−Channel, SOT−23
Features
• Leading Trench Technology for Low RDS(on)
• −1.8 V Rated for Low Voltage Gate Drive
• SOT−23 Surface Mount for Small Footprint (3 x 3 mm)
• Pb−Free Package is Available
Applications
• High Side Load Switch
• DC−DC Conversion
• Cell Phone, Notebook, PDAs, etc.
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
VDSS
−8.0
V
Gate−to−Source Voltage
VGS
±8.0
V
Continuous Drain
Current (Note 1)
t ≤ 10 s TA = 25°C
ID
TA = 70°C
−3.7
A
−3.0
Power Dissipation
(Note 1)
t ≤ 10 s
PD
0.96 W
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
IDM
−11
A
TJ,
−55 to °C
TSTG
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IS
−1.2
A
TL
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State
Junction−to−Ambient − t ≤ 10 s
RqJA
RqJA
160 °C/W
130
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V(BR)DSS
−8.0 V
RDS(on) Typ
39 mW @ −4.5 V
52 mW @ −2.5 V
79 mW @ −1.8 V
ID Max
−3.7 A
P−Channel
D
G
3
1
2
SOT−23
CASE 318
STYLE 21
S
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain
3
TR7 M G
G
1
Gate
2
Source
TR7 = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
NTR2101PT1
SOT−23 3000/Tape & Reel
NTR2101PT1G SOT−23 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 4
Publication Order Number:
NTR2101P/D