NTE861 Datasheet, PDF (1/3 Pages) NTE Electronics – Integrated Circuit Quad, Normally Open, SPST JFET Analog Switch w/Disable

NTE861
Integrated Circuit
Quad, Normally Open, SPST JFET
Analog Switch ^w/Disable
Description:
The NTE861 is a monolithic combination of bipolar and JFET technology producing a one chip quad
JFET switch. A unique circuit technique is employed to maintain a constant resistance over the ana-
log voltage range of ±10V. The input is designed to operate from minimum TTL levels, and switch
operation also ensures a break–before–make action.
Features:
D Analog signals are not loaded
D Constant “ON” resistance for signals up to ±10V and 100kHz
D Pin compatible with CMOS switches with the advantage of blow out free handling
D Small signal analog signals to 50MHz
D Break–before–make action
D High open switch isolation at 1.0MHz
D Low leakage in “OFF” state
D TTL, DTL, RTL compatibility
D Single disable pin opens all switches in package
This device operates from a ±15V supply and swings a ±10V analog signal. The JFET switches are
designed for applications where a dc to medium frequency analog signal needs to be controlled.
Absolute Maximum Ratings:
Positive Supply–Negative Supply (V_CC –V_EE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V
Reference Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_EE ≤ V_R ≤ V_CC
Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_R –4.0V ≤ V_IN ≤ V_R +6.0V
Analog Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_EE ≤ V_A ≤ V_CC +6V; V_A ≤ V_EE +36V
Analog Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I_A < 20mA
Power Dissipation (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500mW
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0° to 70°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to 150°C
Typical Thermal Resistance, Junction–to–Ambient, R_thJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C
Note 1 For operating at high temperature this device must be derated based on a +100°C maximum
junction temperature and a thermal resistance of +150°C/W.