NTE812 Datasheet, PDF (1/2 Pages) NTE Electronics – Integrated Circuit Audio Power Amplifier, 1W

NTE812
Integrated Circuit
Audio Power Amplifier, 1W
Description:
The NTE812 is a monolithic integrated circuit in a 14–Lead DIP type package designed for use in driver
and power amplifier applications at frequencies from 50Hz to 40kHz. This device will deliver up to 1W
RMS output power into an 8Ω load. The high input impedance and low standby current provide excellent
low–power audio output performance for portable applications. The high peak current capability can
be utilized for direct driving of complementary power transistors in high power amplifier applications.
Features:
D 1 Watt RMS Power into 8Ω with THD = 0.65% Typ
D Peak Output Current: 1A
D Wide Supply Voltage Range: 4V to 13V
D High Input Impedance
Applications:
D Radios
D Phonographs
D Portable Communications Receivers
D Complementary Power Amplifier Drivers
D Servo Drivers
Absolute Maximum Ratings: (T_A = +25°C unless otherwise specified)
Supply Voltage (Note 1), V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Output Current, I_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
Continuous Power Dissipation (T_A ≤ +25°C, Note 2), P_D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1W
Derate Above 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.7mW/°C
Operating Ambient Temperature Range, T_opr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55° to +100°C
Storage Temperature Range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +150°C
Lead Temperature (During Soldering, 1/16” from case, 10sec), T_L . . . . . . . . . . . . . . . . . . . . . +260°C
Note 1. Voltage values are with respect to network GND terminal.
Note 2. This rating is valid for the condition that all pins are soldered into a printed circuit board with
a 2” x 2” copper layer area of 14 mil thickness. Most of the heat is conducted to the printed
circuit board copper layer through Pin8 (Input GND).