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DS25BR400_08 Datasheet, PDF (8/14 Pages) National Semiconductor (TI) – Quad 2.5 Gbps CML Transceiver with Transmit De-Emphasis and Receive Equalization
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ESD Ratings (Note 9)
HBM
CDM
MM
6kV
1kV
350V
Supply Voltage (VCC)
CMOS/TTL Input Voltage
CML Input/Output Voltage
Junction Temperature
Storage Temperature
Lead Temperature
Soldering, 4 sec
Thermal Resistance, θJA
Thermal Resistance, θJC
Thermal Resistance, ΦJB
−0.3V to 4V
−0.3V to (VCC +0.3V)
−0.3V to (VCC +0.3V)
+150°C
−65°C to +150°C
+260°C
22.3°C/W
3.2°C/W
10.3°C/W
Recommended Operating Ratings
Supply Voltage (VCC-GND)
Supply Noise Amplitude
10 Hz to 2 GHz
Ambient Temperature
Case Temperature
Min Typ Max Units
3.135 3.3 3.465 V
100 mVPP
−40
+85 °C
100 °C
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
LVCMOS DC SPECIFICATIONS
VIH
High Level Input
Voltage
VIL
Low Level Input
Voltage
IIH
High Level Input
VIN = VCC
Current
IIL
Low Level Input Current VIN = GND
RPU
Pull-High Resistance
RECEIVER SPECIFICATIONS
VID
Differential Input
AC Coupled Differential Signal.
Voltage Range
Below 1.25 Gb/s
At 1.25 Gbps–3.125 Gbps
Above 3.125 Gbps
This parameter is not production tested.
VICM
RITD
Common Mode Voltage Measured at receiver inputs reference to ground.
at Receiver Inputs
Input Differential
On-chip differential termination between
Termination
IN+ or IN−. Figure 7
Min
2.0
−0.3
−10
75
 
100
100
100
 
84
Typ
(Note 2)
Max
Units
VCC +0.3
V
0.8
V
10
µA
94
124
µA
35
kΩ
 
1750
1560
1200
 
 
mVP-P
mVP-P
mVP-P
 
1.3
V
100
116
Ω
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