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ADC08100 Datasheet, PDF (6/19 Pages) National Semiconductor (TI) – 8-Bit, 20 MSPS to 100 MSPS, 1.3 mW/MSPS A/D Converter
Converter Electrical Characteristics (Continued)
The following specifications apply for VA = DR VD = +3.0VDC, VRT = +1.9V, VRB = 0.3V, CL = 10 pF, fCLK = 100 MHz at 50%
duty cycle. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C (Notes 7, 8)
Symbol
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 9)
Units
(Limits)
POWER SUPPLY CHARACTERISTICS
DR ID Output Driver Supply Current
DC Input
fIN = 10 MHz, VIN = FS − 3 dB
DC Input
1
2
mA (max)
8
mA (max)
42
52
IA +
DRID
Total Operating Current
fIN = 10 MHz, VIN = FS − 3 dB,
49
PD = Low
CLK Low, PD = Hi
0.2
mA (max)
DC Input
126
156
mW (max)
PC
Power Consumption
fIN = 10 MHz, VIN = FS − 3 dB,
147
mW
PD = Low
CLK Low, PD = Hi
0.6
mW
FSE change with 2.7V to 3.3V change
PSRR1 Power Supply Rejection Ratio
in VA
54
dB
SNR change with 200 mV at 1 MHz
PSRR2 Power Supply Rejection Ratio
on supply
TBD
dB
AC ELECTRICAL CHARACTERISTICS
fC1
Maximum Conversion Rate
fC2
Minimum Conversion Rate
tCL
Minimum Clock Low Time
tCH
Minimum Clock High Time
tOH
Output Hold Time
tOD
Output Delay
Pipeline Delay (Latency)
CLK Rise to Data Invalid
CLK Rise to Data Valid
125
100
MHz (min)
20
MHz
4.5
ns (min)
4.5
ns (min)
4.4
ns
5.9
8.5
ns (max)
2.5
Clock Cycles
tAD
Sampling (Aperture) Delay
CLK Fall to Acquisition of Data
1.5
tAJ
Aperture Jitter
2
ns
ps rms
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = AGND = DR GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supplies (that is, less than AGND or DR GND, or greater than VA or DR VD), the current at that pin
should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input
current of 25 mA to two.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150˚C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. In the 24-pin
TSSOP, θJA is 92˚C/W, so PDMAX = 1,358 mW at 25˚C and 435 mW at the maximum operating ambient temperature of 85˚C. Note that the power consumption of
this device under normal operation will typically be about 162 mW (126 mW quiescent power + 12 mW reference ladder power + 24 mW to drive the output bus
capacitance). The values for maximum power dissipation listed above will be reached only when the ADC08100 is operated in a severe fault condition (e.g., when
input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 6: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any post 1986 National
Semiconductor Linear Data Book, for other methods of soldering surface mount devices.
Note 7: The analog inputs are protected as shown below. Input voltage magnitudes up to VA + 300 mV or to 300 mV below GND will not damage this device.
However, errors in the A/D conversion can occur if the input goes above DR VD or below GND by more than 100 mV. For example, if VA is 2.7VDC the full-scale input
voltage must be ≤2.6VDC to ensure accurate conversions.
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