LP3952 Datasheet, PDF (5/44 Pages) National Semiconductor (TI) – 6-Channel Color LED Driver with Audio Synchronization

Electrical Characteristics (Notes 2, 10)
Limits in standard typeface are for T_J = 25°C. Limits in boldface type apply over the operating ambient temperature range (-30°C
< T_A < +85°C). Unless otherwise noted, specifications apply to the LP3952 Block Diagram with: V_DD1 = V_DD2 = 3.6V, V_DDIO = 2.8V,
C_VDD = C_VDDIO = 100 nF, C_OUT = C_IN = 10 μF, C_VDDA = 1 μF, C_REF = 100 nF, L₁ = 4.7 μH, R_RGB = 5.6 kΩ and R_RT = 82 kΩ (Note
11).
Symbol
Parameter
Condition
Min Typ Max Units
I_VDD Standby supply current NSTBY (bit) = L, NRST (pin) = H
(V_DD1 + V_DD2)
SCL=H, SDA = H
No-boost supply current NSTBY (bit) = H,
(V_DD1 + V_DD2)
EN_BOOST(bit) = L
SCL = H, SDA = H
Audio sync and LEDs OFF
1
8
μA
450 μA
No-load supply current
(V_DD1 + V_DD2)
NSTBY (bit) = H,
EN_BOOST (bit) = H
SCL = H, SDA = H
Audio sync and LEDs OFF
Autoload OFF
1
mA
I_VDD
I_VDDIO
RGB drivers
(V_DD1 + V_DD2)
Audio synchronization
(V_DD1 + V_DD2)
V_DDIO Standby Supply
current
CC mode at R1, G1, B1 and R2, G2, B2 set to 15 mA
SW mode
Audio sync ON
V_DD1,2 = 2.8V
V_DD1,2 = 3.6V
NSTBY (bit)=L
SCL = H, SDA = H
150
μA
150
390
μA
700
1
μA
I_{EXT_LDO}
V_DDA
External LDO output 7V tolerant application only
current
(V_DD1, V_DD2, V_DDA)
I_BOOST = 300 mA
Output voltage of internal (Note 12)
LDO for analog parts
6.5 mA
2.72 2.80 2.88 V
-3
+3
%
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pins.
Note 3: Battery/Charger voltage should be above 6V no more than 10% of the operational lifetime.
Note 4: Voltage tolerance of LP3952 above 6.0V relies on fact that V_DD1 and V_DD2 (2.8V) are available (ON) at all conditions. If V_DD1 and V_DD2 are not available
(ON) at all conditions, National Semiconductor does not guarantee any parameters or reliability for this device.
Note 5: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J=160°C (typ.) and disengages at
T_J=140°C (typ.).
Note 6: For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1412 : Micro SMDxt Wafer Level Chip
Scale Package
Note 7: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Note 8: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP = 125°C), the maximum power
dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θ_JA), as given by the
following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
Note 9: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 10: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 11: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
Note 12: V_DDA output is not recommended for external use.
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