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ADC16061 Datasheet, PDF (5/20 Pages) National Semiconductor (TI) – Self-Calibrating 16-Bit, 2.5 MSPS, 390 mW A/D Converter
Pin Descriptions and Equivalent Circuits (Continued)
Digital Power
20
VD
12,
13,
14,
19,
41,
42, 43
DGND
34
VD I/O
33 DGND I/O
NC
2, 3,
9, 15,
NC
16, 39
Positive digital supply pin. This pin should be connected to the
same clean, quiet +5V source as is VA and bypassed to DGND
with a 0.1 µF monolithic capacitor in parallel with a 10µF capacitor,
both located within 1 cm of the power pin.
The ground return for the digital supply. AGND and DGND should
be connected together directly beneath the ADC16061 package.
See Section 5 (Layout and Grounding) for more details.
Positive digital supply pin for the ADC16061’s output drivers. This
pin should be connected to a +3V to +5V source and bypassed to
DGND I/O with a 0.1 µF monolithic capacitor. If the supply for this
pin is different from the supply used for VA and VD, it should also
be bypassed with a 10 µF capacitor. All bypass capacitors should
be located within 1 cm of the supply pin.
The ground return for the digital supply for the ADC16061’s output
drivers. This pin should be connected to the system digital ground,
but not be connected in close proximity to the ADC16061’s DGND
or AGND pins. See Section 5.0 (Layout and Grounding) for more
details.
All pins marked NC (no connect) should be left floating. Do not
connect the NC pins to ground, power supplies, or any other
potential or signal. These pins are used for test in the
manufacturing process.
5
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