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54F825SDM Datasheet, PDF (5/8 Pages) National Semiconductor (TI) – 8-Bit D-Type Flip-Flop
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AC Electrical Characteristics
Symbol
Parameter
fmax
tPLH
tPHL
tPHL
tPZH
tPZL
tPHZ
tPLZ
Maximum Clock Frequency
Propagation Delay
CP to On
Propagation Delay
CLR to On
Output Enable Time
OE to On
Output Disable TIme
OE to On
74F
TA e a25 C
VCC e a5 0V
CL e 50 pF
Min
Typ
Max
100
160
20
65
95
20
66
95
40
74
12 0
20
65
10 5
20
66
10 5
15
35
70
15
33
70
54F
TA VCC e Mil
CL e 50 pF
Min
Max
60
20
10 5
20
10 5
40
13 0
20
13 0
20
13 0
10
75
10
75
74F
TA VCC e Com
CL e 50 pF
Min
Max
70
20
10 5
20
10 5
40
13 0
20
11 5
20
11 5
15
75
15
75
Units
MHz
ns
ns
ns
AC Operating Requirements
Symbol
Parameter
ts(H)
ts(L)
th(H)
th(L)
ts(H)
ts(L)
th(H)
th(L)
tw(H)
tw(L)
tw(L)
trec
Setup Time HIGH or LOW
Dn to CP
Hold Time HIGH or LOW
Dn to CP
Setup Time HIGH or LOW
EN to CP
Hold Time HIGH or LOW
EN to CP
CP Pulse Width
HIGH or LOW
CLR Pulse Width LOW
CLR Recovery Time
74F
TA e a25 C
VCC e a5 0V
Min
Max
25
25
25
25
45
25
20
0
50
50
50
50
54F
TA VCC e Mil
Min
Max
40
40
25
25
50
30
30
20
60
60
50
50
74F
TA VCC e Com
Min
Max
30
30
25
25
50
30
10
0
60
60
50
50
Units
ns
ns
ns
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 825 S C X
Temperature Range Family
74FeCommercial
54FeMilitary
Device Type
Package Code
SP e Slim Plastic DIP
SD e Slim Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline (SOIC)
Special Variations
X e Devices shipped in 13 reels
QB e Military grade with environmental
and burn-in processing shipped
in tubes
Temperature Range
CeCommercial (0 C to a70 C)
MeMilitary (b55 C to a125 C)
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