LMK04000 Datasheet, PDF (42/54 Pages) National Semiconductor (TI) – Low-Noise Clock Jitter Cleaner with Cascaded PLLs

TABLE 31. Typical Current Consumption for Selected Functional Blocks
Block
Condition
Typical I_CC
(Temp = 25 °C,
V_CC = 3.3 V)
(mA)
Entire device,
core current
Single input clock (CLKIN_SEL = 0 or 1); LOS
disabled; PLL1 and PLL2 locked; All CLKouts are off;
No LVPECL emitter resistors connected
REFMUX
Enable auto-switch mode (CLKIN_SEL = 2 or 3)
LOS
Enable LOS (LOS_TYPE = 1, or 2, or 3)
Low Channel The low channel internal buffer is enabled when
Internal Buffer CLKout0 is enabled
High Channel The high channel internal buffer is enabled when one
Internal Buffer of CLKout1 through CLKout4 is enabled
Divide circuitry
per output
Divider bypassed (CLKout_MUX = 0, 2)
Divider enabled, divide = 2 (CLKout_MUX = 1, 3)
Divider enabled, divide > 2 (CLKout_MUX = 1, 3)
Delay circuitry
per output
Delay bypassed (CLKout_MUX = 0, 1)
Delay enabled, delay < 8 (CLKout_MUX = 2, 3)
Delay enabled, delay > 7 (CLKout_MUX = 2, 3)
Fout Buffer
EN_Fout = 1
LVDS Buffer LVDS buffer, enabled
LVPECL/2VPECL buffer (enabled and with 120 Ω
emitter resistors)
LVPECL/
LVPECL/2VPECL buffer (disabled and with 120 Ω
2VPECL Buffer emitter resistors)
LVPECL/2VPECL (disabled and with no emitter
resistors)
LVCMOS Buffer ^{LVCMOS buffer static ICC, CL = 5 pF}
(Note 44)
LVCMOS buffer dynamic I_CC, C_L = 5 pF, CLKout = 100
MHz
Entire device LMK0400x (Note 45, Note 46)
(Single input
LMK0401x (Note 45, Note 46)
clock
LMK0403x (Note 45, Note 46)
(CLKIN_SEL = 0
or 1); LOS
disabled; PLL1
and PLL2 locked;
Fout disabled; All
CLKouts are on;
No delay); Divide
> 2 on each
output.
115
4.3
3.6
10
10
0
5.3
8.5
0
5.8
9.9
14.5
19.3
40
21.7
0
4.5
16
379.5
377.5
337.1
Power
Dissipated in
device
(mW)
Power
Dissipated in
LVPECL/
2VPECL Emitter
Resistors
(mW)
380
-
14
-
12
-
33
-
33
-
0
-
17
-
28
-
0
-
19
-
33
-
48
-
64
-
82
50
47
25
0
-
15
-
53
-
1102
150
996
250
1012
100
Note 44: Dynamic power dissipation of LVCMOS buffer varies with output frequency and can be found in the LVCMOS dynamic I_CC vs frequency plot, as shown
in Section 13.1 CLOCK OUTPUT AC CHARACTERISTICS. Total power dissipation of the LVCMOS buffer is the sum of static and dynamic power dissipation.
CLKoutXa and CLKoutXb are each considered an LVCMOS buffer.
Note 45: Assuming ThetaJ = 27.4 °C/W, the total power dissipated on chip must be less than 40/27.4 = 1450 mW to guarantee a junction temperature is less
than 125 °C.
Note 46: Worst case power dissipation can be estimated by multiplying typical power dissipation with a factor of 1.2.
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