MNLM1575-12-X Datasheet, PDF (4/14 Pages) National Semiconductor (TI) – SIMPLE SWITCHER 1A STEP-DOWN VOLTAGE REGULATOR

MNLM1575-12-X REV 0D1
MICROCIRCUIT DATA SHEET
(Continued)
Note 3:
Note 4:
The package material for these devices allows much improved heat transfer over our
standard ceramic packages. In order to take full advantage of this improved heat
transfer, heat sinking must be provided between the package base (directly beneath
the die), and either metal traces on, or thermal vias through, the printed circuit
board. Without this additional heat sinking, device power dissipation must be
calculated using junction-to-ambient, rather than junction-to-case, thermal
resistance. It must not be assumed that the device leads will provide substantial
heat transfer out of the package, since the thermal resistance of the leadframe
material is very poor, relative to the material of the package base. The stated
junction-to-case thermal resistance is for the package material only, and does not
account for the additional thermal resistance between the package base and the
printed circuit board. The user must determine the value of the additional thermal
resistance and must combine this with the stated value for the package, to calculate
the total allowed power dissipation for the device.
Human body model, 1.5k Ohms in series with 100pF.
Recommended Operating Conditions
Temperature Range
Supply Voltage
-55 C < Ta < +125 C
40V
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