LMP8602_10 Datasheet, PDF (4/24 Pages) National Semiconductor (TI) – 60V Common Mode, Fixed Gain, Bidirectional Precision Current Sensing Amplifier

Symbol
Parameter
TCR_F-INT Output Impedance Filter Resistor Drift
A1 V_OUT A1 Ouput Voltage Swing
Output Buffer (From A2 (pin 4) to OUT ( pin 5 )
V_OS
Input Offset Voltage
K2
Gain (Note 15)
I_B
Input Bias Current of A2 (Note 11)
A2 V_OUT
A2 Ouput Voltage Swing
(Note 12, Note 13)
I_SC
Output Short-Circuit Current (Note 14)
Conditions
V_OL
V_OH
0V ≤ V_CM ≤ V_S
LMP8602
LMP8603
R_L = ∞
V_OL,
LMP8602
R_L = 100 kΩ
LMP8603
V_OH,
R_L = 100 kΩ
Sourcing, V_IN = V_S, V_OUT = GND
Sinking, V_IN = GND, V_OUT = V_S
Min
(Note 7)
4.95
Typ
Max
(Note 5) (Note 7)
±5
±50
2
10
4.985
Units
ppm/°C
mV
V
−2
±0.5
2
mV
−2.5
2.5
4.975
5
5.025
V/V
9.95
10
10.05
−40
fA
±20
nA
10
40
mV
10
80
4.98 4.99
V
–25
–42
–60
mA
30
48
65
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of the device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: The electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or
specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T_J(MAX), θ_JA, and the ambient temperature, T_A. The maximum
allowable power dissipation P_DMAX = (T_J(MAX) - T_A) / θ_JA or the number given in Absolute Maximum Ratings, whichever is lower.
Note 4: Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per JESD22-C101-
C.
Note 5: Typical values represent the most likely parameter norms at T_A = +25°C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed.
Note 6: For the MSOP package, the bare board spacing at the solder pads of the package will be to small for reliable use at higher voltages (V_CM >25V) Therefore
it is strongly advised to add a conformal coating on the PCB assembled with the LMP8602 and LMP8603.
Note 7: Datasheet min/max specification limits are guaranteed by test.
Note 8: Slew rate is the average of the rising and falling slew rates.
Note 9: Offset voltage drift determined by dividing the change in V_OS at temperature extremes into the total temperature change.
Note 10: AC Common Mode Signal is a 5V_PP sine-wave (0V to 5V) at the given frequency.
Note 11: Positive current corresponds to current flowing into the device.
Note 12: For this test input is driven from A1 stage in uni-directional mode (Offset pin connected to GND).
Note 13: For V_OL, R_L is connected to V_S and for V_OH, R_L is connected to GND.
Note 14: Short-Circuit test is a momentary test. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed
junction temperature of 150°C.
Note 15: Both the gain of the preamplifier A1_V and the gain of the buffer amplifier A2_V are measured individually. The over all gain of both amplifiers A_V is also
measured to assure the gain of all parts is always within the A_V limits.
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