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LM3674_0609 Datasheet, PDF (4/15 Pages) National Semiconductor (TI) – 2MHz, 600mA Step-Down DC-DC Converter in SOT 23-5
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VIN Pin: Voltage to GND
EN, FB, SW Pin:
Continuous Power Dissipation
Junction Temperature (TJ-MAX)
Storage Temperature Range
Maximum Lead Temperature
(Soldering, 10 sec.)
ESD Rating (Note 3)
Human Body model: All Pins
Machine Model: All Pins
−0.2V to 6.0V
(GND−0.2V) to
(VIN + 0.2V)
Internally Limited
+125˚C
−65˚C to +150˚C
260˚C
2 kV
200V
Operating Ratings (Notes 1, 2)
Input Voltage Range (Note 11)
Recommended Load Current
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range
2.7V to 5.5V
0A to 600 mA
−30˚C to +125˚C
−30˚C to +85˚C
Thermal Properties
Junction-to-Ambient
Thermal Resistance (θJA)
(SOT23-5) for a 2 layer
board (Note 6)
250˚C/W
Junction-to-Ambient
Thermal Resistance (θJA)
(SOT23-5) for a 4 layer
board (Note 6)
130˚C/W
Electrical Characteristics (Notes 2, 9, 10) Limits in standard typeface are for TJ = 25˚C. Limits in boldface
type apply over the full operating junction temperature range (−30˚C ≤ TJ ≤ 125˚C). Unless otherwise noted, specifications
apply to the LM3674 with VIN = EN = 3.6V
Symbol
VFB
Parameter
Feedback Voltage (Note 12, 13)
Line Regulation
Load Regulation
VREF
ISHDN
IQ
Internal Reference Voltage
Shutdown Supply Current
DC Bias Current into VIN
RDSON (P)
RDSON (N)
ILIM
VIH
VIL
IEN
FOSC
Pin-Pin Resistance for PFET
Pin-Pin Resistance for NFET
Switch Peak Current Limit
Logic High Input
Logic Low Input
Enable (EN) Input Current
Internal Oscillator Frequency
Condition
IO = 10mA
2.7V ≤ VIN ≤ 5.5V
IO = 100 mA
100 mA ≤ IO ≤ 600 mA
VIN = 3.6V
(Note 7)
EN = 0V
No load, device is not
switching (FB=0V)
ISW = 200mA
ISW = 200mA
Open Loop (Note 8)
PWM Mode
Min
Typ
Max
-4
+4
0.083
0.0010
0.5
0.01
1
300
600
380
500
250
400
830
1020
1200
1.0
0.4
0.01
1
1.6
2
2.6
Units
%
%/V
%/mA
V
µA
µA
mΩ
mΩ
mA
V
V
µA
MHz
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin (MIL-STD-883 3015.7). National Semiconductor recommends that all intergrated circuits be handled with appropriate precautions. Failure to
observe proper ESD handling techniques can result in damage.
Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150˚C (typ.) and disengages at TJ =
130˚C
Note 5: In Applications where high power dissipation and /or poor package resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA-MAX ) is dependent on the maximum operating junction temperature (TJ-MAX ), the maximum power dissipation of the device in
the application (PD-MAX ) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation: TA-MAX = TJ-MAX-
(θJA x PD-MAX). Refer to Dissipation ration table for PD-MAX values at different ambient temperatures.
Note 6: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care
must be given to thermal dissipation issues in board design. Value specified here 250˚C/W is based on measurement results using a 2 layer, 4" X 3", 2 oz. Cu board
as per JEDEC standards. The (θJA) is 130˚C/W if a 4 layer, 4" X 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.
Note 7: For the ADJ version the resistor dividers should be selected such that at the desired output voltage, the voltage at the FB pin is 0.5V.
Note 8: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects open
loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor current
measured in the application circuit by increasing output current until output voltage drops by 10%.
Note 9: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 10: The parameters in the electrical characteristic table are tested at VIN = 3.6V unless otherwise specified. For performance over the input voltage range refer
to datasheet curves.
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