MNLM185B-X Datasheet, PDF (3/11 Pages) National Semiconductor (TI) – MICROCIRCUIT DATA SHEET

MNLM185B-X REV 0B0
MICROCIRCUIT DATA SHEET
(Absolute Maximum Ratings)
(Note 1)
Reverse Current
Forward Current
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature
Lead Temperature
(Soldering, 10 seconds)
Thermal Resistance
ThetaJA
E-Pkg (Still Air)
E-Pkg (500LF/Min Air flow)
H-Pkg (Still Air)
H-Pkg (500LF/Min Air flow)
ThetaJC
E-Pkg
H-Pkg
Package Weight
(Typical)
E-Pkg
H-Pkg
ESD Tolerance
(Note 2)
30mA
10mA
-55 C to +125 C
150 C
-55 C to +150 C
300 C
100 C/W
73 C/W
300 C/W
139 C/W
25 C/W
57 C/W
TBD
TBD
500V
Note 1:
Note 2:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Operating Ratings indicate conditions for which the device is functional, but do not
guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade
when the device is not operated under the listed test conditions.
Human body model, 1.5k Ohms in series with 100pF
3