LMH6739_07 Datasheet, PDF (3/12 Pages) National Semiconductor (TI) – Very Wideband, Low Distortion Triple Video Buffer

Symbol
Parameter
Conditions
PSRR
CMRR
I_CC
Power Supply Rejection Ratio (Note
8)
Common Mode Rejection Ratio
(Note 8)
Supply Current (Note 8)
All three amps Enabled, No Load
Min
(Note 7)
50
48.5
46
44
Supply Current Disabled V⁺
Supply Current Disabled V^−
Internal Feedback & Gain Set
Resistor Value
Gain Error
Miscellaneous Performance
R_IN+
C_IN+
R_IN−
R_O
V_O
Non-Inverting Input Resistance
Non-Inverting Input Capacitance
Inverting Input Impedance
Output Impedance
Output Voltage Range (Note 8)
R_L = ∞
R_L = ∞
R_L = ∞
Output impedance of input buffer.
DC
R_L = 100Ω
CMIR
I_O
R_L = ∞
Common Mode Input Range (Note CMRR > 40 dB
8)
Linear Output Current (Notes 4, 8) V_IN = 0V, V_OUT < ±30 mV
I_SC
I_IH
I_IL
V_DMAX
V_DMIM
Short Circuit Current (Note 9)
Disable Pin Bias Current High
Disable Pin Bias Current Low
Voltage for Disable
Voltage for Enable
V_IN = 2V Output Shorted to Ground
Disable Pin = V⁺
Disable Pin = 0V
Disable Pin ≤ V_DMAX
Disable Pin ≥ V_DMIN
375
±3.25
±3.1
±3.65
±3.5
±1.9
±1.7
80
60
2.0
Typ
(Note 6)
53
50
32
1.9
1.1
450
0.2
1000
.8
30
0.05
±3.5
±3.8
±2.0
90
160
10
−350
Max
(Note 7)
35
40
2.2
1.3
525
±1.1
0.8
Units
dB
dB
mA
mA
mA
Ω
%
kΩ
pF
Ω
Ω
V
V
mA
mA
μA
μA
V
V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.
Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that T_J = T_A. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where T_J>
T_A. See Applications Information for information on temperature de-rating of this device. Min/Max ratings are based on product characterization and simulation.
Individual parameters are tested as noted.
Note 3: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 4: The maximum output current (I_OUT) is determined by device power dissipation limitations. See the Power Dissipation section of the Application Information
for more details.
Note 5: The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
Note 6: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 7: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using the Statistical Quality
Control (SQC) method.
Note 8: Parameter 100% production tested at 25° C.
Note 9: Short circuit current should be limited in duration to no more than 10 seconds. See the Power Dissipation section of the Application Information for more
details.
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