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LMC7215_06 Datasheet, PDF (3/11 Pages) National Semiconductor (TI) – Micro-Power, Rail-to-Rail CMOS Comparators with Push-Pull/Open-Drain Outputs and TinyPak™ Package
2.7V to 5V Electrical Characteristics (Continued)
Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.7V to 5V, V− = 0V, VCM = VO = V+/2. Boldface limits
apply at the temperature extremes.
Typ
LMC7215 LMC7225
Symbol
Parameter
Conditions
(Note 5)
Limit
Limit
Units
ISC−
ILeakage
IS
Current (Note 10)
Output Short Circuit
Current (Note 10)
Output Leakage Current
Supply Current
V+ = 5.0V, Sourcing
V+ = 2.7V, Sinking
V+ = 5.0V, Sinking
V+ = 2.2V
VIN+ = 0.1V, VIN− = 0V,
VOUT = 15V
V+ = 5.0V
VIN+ = 5V, VIN− = 0V
(Note 6)
(Note 6)
50
NA
mA
12
mA
30
mA
nA
0.01
NA
500
max
0.7
1
1
µA
1.2
1.2
max
AC Electrical Characteristics
Unless otherwise specified, TJ = 25˚C, V+ = 5V, V− = 0V, VCM = V+/2
Symbol
Parameter
Conditions
trise
Rise Time
Overdrive = 10 mV (Note 8)
tfall
Fall Time
Overdrive = 10 mV (Note 8)
tPHL
Propagation Delay
(Notes 8, 9)
Overdrive = 10 mV
(High to Low)
Overdrive = 100 mV
V+ = 2.7V
Overdrive = 10 mV
(Notes 8, 9)
Overdrive = 100 mV
tPLH
Propagation Delay
(Notes 8, 9)
Overdrive = 10 mV
(Low to High)
Overdrive = 100 mV
V+ = 2.7V
Overdrive = 10 mV
(Notes 8, 9)
Overdrive = 100 mV
LMC7215
Typ
(Note 5)
1
0.4
24
12
17
11
24
12
17
11
LMC7225
Typ
(Notes 5, 8)
12.2
0.35
24
12
17
11
29
17
22
16
Units
µs
µs
µs
µs
µs
µs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Note 5: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: CMRR measured at VCM = 0V to 2.5V and 2.5V to 5V when VS = 5V, VCM = 0.2V to 1.35V and 1.35V to 2.7V when VS = 2.7V. This eliminates units that
have large VOS at the VCM extremes and low or opposite VOS at VCM = VS/2.
Note 8: All measurements made at 10 kHz. A 100 kΩ pull-up resistor was used when measuring the LMC7225. CLOAD = 50 pF including the test jig and scope
probe. The rise times of the LMC7225 are a function of the R-C time constant.
Note 9: Input step voltage for the propagation measurements is 100 mV.
Note 10: Do not short the output of the LMC7225 to voltages greater than 10V or damage may occur.
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