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LM380_00 Datasheet, PDF (3/9 Pages) National Semiconductor (TI) – 2.5W Audio Power Amplifier | |||
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
Peak Current
Package Dissipation 14-Pin DIP (Note
7)
Package Dissipation 8-Pin DIP (Note 7)
Input Voltage
Storage Temperature
22V
1.3A
8.3W
1.67W
±0.5V
â65ËC to
+150ËC
Operating Temperature
Junction Temperature
Lead Temperature (Soldering, 10 sec.)
ESD rating to be determined
Thermal Resistance
θJC (14-Pin DIP)
θJC (8-Pin DIP)
θJA (14-Pin DIP)
θJA (8-Pin DIP)
0ËC to +70ËC
+150ËC
+260ËC
30ËC/W
37ËC/W
79ËC/W
107ËC/W
Electrical Characteristics (Note 2)
Symbol
POUT(RMS)
AV
VOUT
ZIN
THD
PSRR
VS
BW
IQ
VOUTQ
IBIAS
ISC
Parameter
Output Power
Gain
Output Voltage Swing
Input Resistance
Total Harmonic Distortion
Power Supply Rejection Ratio
Supply Voltage
Bandwidth
Quiescent Supply Current
Quiescent Output Voltage
Bias Current
Short Circuit Current
Conditions
RL = 8â¦, THD = 3% (Notes 4, 5)
RL = 8â¦
(Notes 5, 6)
(Note 3)
POUT = 2W, RL = 8â¦
Inputs Floating
Min
Typ
Max Units
2.5
W
40
50
60
V/V
14
150k
Vp-p
â¦
0.2
%
38
dB
10
22
V
100k
Hz
7
25
mA
8
9.0
10
V
100
nA
1.3
A
Note 1: âAbsolute Maximum Ratingsâ indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Note 2: VS = 18V and TA = 25ËC unless otherwise specified.
Note 3: Rejection ratio referred to the output with CBYPASS = 5 µF.
Note 4: With device Pins 3, 4, 5, 10, 11, 12 soldered into a 1/16" epoxy glass board with 2 ounce copper foil with a minimum surface of 6 square inches.
Note 5: CBYPASS = 0.47 µfd on Pin 1.
Note 6: The maximum junction temperature of the LM380 is 150ËC.
Note 7: The package is to be derated at 15ËC/W junction to heat sink pins for 14-pin pkg; 75ËC/W for 8-pin.
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