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LM3519 Datasheet, PDF (3/14 Pages) National Semiconductor (TI) – High Frequency Boost White LED Driver with High-Speed PWM Brightness Control
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VIN , En, & LED_rtn Pin
VOUT , Sw Pin
Maximum Junction Temperature
(TJ-MAX)
Storage Temperature Range
−0.3V to +6.5V
−0.3V to +21V
+150˚C
−65˚C to +150˚C
ESD Rating (Note 2)
Human Body Model:
Machine Model:
Operating Ratings
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range
Input Voltage Range
2kV
200V
−40˚C to +125˚C
−40˚C to +85˚C
2.7V to 5.5V
Thermal Properties (Note 4)
Junction-to-Ambient Thermal Resistance (θJA) 220˚C/W
Electrical Characteristics (Note 5) Limits in standard typeface are for TJ = +25˚C. Limits in bold typeface
apply over the full operating junction temperature range (−40˚C ≤ TJ ≤ +125˚C). VIN = 3.6V, unless otherwise stated.
Symbol
IQ
ILED(TOL)
OVP
ILIM
RDS(ON)
ILEAKAGE
RLED_rtn(ON)
FS
IEN
En
Parameter
Supply Current
LED Current
Tolerance/Variation
Over-Voltage Protection
Threshold
Switch Current Limit
Power NMOS Switch ON
Resistance
Switch Leakage
LED_rtn NMOS Switch
ON Resistance
Switching Frequency
Enable Pin Bias Current
(Note 3)
Enable Threshold
Conditions
Shutdown: VEN = 0V
Not Switching: VEN = 1.8V
Switching: VEN = 1.8V,
LED_rtn current = 30mA
VIN = 3.6V, 2.2µH,
4LEDs
OVP ON
OVP OFF
L = 2.2µH
VSW = 3.6V, VEN = 0V
ILED = 20 mA , L = 1µH
4LEDs
VEN = 0V
VEN = 1.8V
Device On
Device Off
Min
Typ
Max Units
0.1
360
500
µA
550
900
–10
5.5
10
%
18
18.9
20
V
17.8
18.6
19.8
750
mA
455
mΩ
0.1
2
µA
8.0
Ω
5.4
MHz
0.1
µA
1.1
2
0.9
V
0.3
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics table.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly
into each pin.
Note 3: Current flows into the pin.
Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,
and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is
calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature.
Note 5: Min and max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
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