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ADC108S102 Datasheet, PDF (3/17 Pages) National Semiconductor (TI) – 8-Channel, 500 kSPS to 1 MSPS, 10-Bit A/D Converter
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Analog Supply Voltage VA
Digital Supply Voltage VD
Voltage on Any Pin to GND
Input Current at Any Pin (Note 3)
Package Input Current(Note 3)
Power Dissipation at TA = 25˚C
ESD Susceptibility (Note 5)
Human Body Model
Machine Model
Soldering Temperature, Infrared,
10 seconds (Note 6)
Junction Temperature
Storage Temperature
−0.3V to 6.5V
−0.3V to VA + 0.3V,
max 6.5V
−0.3V to VA +0.3V
±10 mA
±20 mA
See (Note 4)
2500V
250V
260˚C
+150˚C
−65˚C to +150˚C
Operating Ratings (Notes 1, 2)
Operating Temperature
VA Supply Voltage
VD Supply Voltage
Digital Input Voltage
Analog Input Voltage
Clock Frequency
−40˚C ≤ TA ≤
+105˚C
+2.7V to +5.25V
+2.7V to VA
0V to VA
0V to VA
8 MHz to 16 MHz
Package Thermal Resistance
Package
16-lead TSSOP on
4-layer, 2 oz. PCB
θJA
96˚C / W
Soldering process must comply with National Semiconduc-
tor’s Reflow Temperature Profile specifications. Refer to
www.national.com/packaging. (Note 6)
ADC108S102 Converter Electrical Characteristics (Note 8)
The following specifications apply for VA = VD = +2.7V to +5.25V, AGND = DGND = 0V, fSCLK = 8 MHz to 16 MHz, fSAMPLE =
500 kSPS to 1 MSPS, and CL = 50pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits
TA = 25˚C.
Symbol
Parameter
Conditions
Typical
Limits
(Note 7)
Units
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
10
Bits
Integral Non-Linearity (End Point
INL
Method)
±0.2
±0.5
LSB (max)
DNL
Differential Non-Linearity
±0.2
±0.5
LSB (max)
VOFF
OEM
Offset Error
Offset Error Match
+0.3
±0.07
±0.7
±0.4
LSB (max)
LSB (max)
FSE
Full Scale Error
+0.2
±0.4
LSB (max)
FSEM
Full Scale Error Match
±0.07
±0.4
LSB (max)
DYNAMIC CONVERTER CHARACTERISTICS
FPBW
Full Power Bandwidth (−3dB)
8
MHz
SINAD
SNR
THD
SFDR
ENOB
ISO
IMD
Signal-to-Noise Plus Distortion Ratio
Signal-to-Noise Ratio
Total Harmonic Distortion
Spurious-Free Dynamic Range
Effective Number of Bits
Channel-to-Channel Isolation
Intermodulation Distortion, Second
Order Terms
Intermodulation Distortion, Third
Order Terms
fIN = 40.2 kHz, −0.02 dBFS
fIN = 40.2 kHz, −0.02 dBFS
fIN = 40.2 kHz, −0.02 dBFS
fIN = 40.2 kHz, −0.02 dBFS
fIN = 40.2 kHz
fIN = 20 kHz
fa = 19.5 kHz, fb = 20.5 kHz
fa = 19.5 kHz, fb = 20.5 kHz
61.8
61.8
−87.0
83.1
9.98
79.7
−83.9
−82.4
61.3
61.4
−73.8
76.0
9.89
dB (min)
dB (min)
dB (max)
dB (min)
Bits (min)
dB
dB
dB
ANALOG INPUT CHARACTERISTICS
VIN
IDCL
CINA
Input Range
DC Leakage Current
Input Capacitance
Track Mode
Hold Mode
0 to VA
±1
33
3
V
µA (max)
pF
pF
3
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