THS4509-Q1 Datasheet, PDF (2/40 Pages) Texas Instruments – WIDEBAND LOW-NOISE LOW-DISTORTION FULLY DIFFERENTIAL AMPLIFIER

THS4509-Q1
SLOS547 – NOVEMBER 2008........................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
T_A
–40°C to 125°C
QFN – RGT
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
Reel of 3000
THS4509QRGTRQ1
TOP-SIDE MARKING
OOSQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V_S– to V_S+
V_I
V_ID
I_O
T_J
T_A
T_stg
Supply voltage
Input voltage
Differential input voltage
Output current⁽¹⁾
Continuous power dissipation
Maximum junction temperature
Operating free-air temperature range
Storage temperature range
Human-Body Model (HBM)
ESD ratings
Charged-Device Model (CDM)
Machine Model (MM)
6V
±V_S
4V
200 mA
See Dissipation Rating Table
150°C
–40°C to 125°C
–65°C to 150°C
2000 V
1500 V
100 V
(1) The THS4509 incorporates a (QFN) exposed thermal pad on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature, which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about
utilizing the QFN thermally enhanced package.
DISSIPATION RATINGS
PACKAGE
RGT (16)
θ_JC
2.4°C/W
θ_JA
39.5°C/W
POWER RATING
T_A ≤ 25°C
2.3 W
T_A = 85°C
225 mW
2
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