THS4041-Q1 Datasheet, PDF (2/24 Pages) Texas Instruments – 165-MHz C-STABLE HIGH-SPEED AMPLIFIER

THS4041ĆQ1
ą
165ĆMHz CĆSTABLE HIGHĆSPEED AMPLIFIER
SGLS229B − FEBRUARY 2004 − REVISED JUNE 2008
functional block diagram
Null
1
IN−
2
8
6
3
IN+
OUT
Figure 1. THS4041 − Single Channel
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±16.5 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V_CC
Output current, I_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mA
Differential input voltage, V_IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±4 V
Maximum junction temperature, T_J (see Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Package thermal impedance, θ_JA (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215°C/W
Operating free-air temperature, T_A: I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 3 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC proposed High-K test PCB, the θ_JA is 126°C/W.
1e+09
Wirebond Life vs. Junction Temperature
1e+08
1e+07
1e+06
100000
10000
1005C 3.7e+06 Hrs (4.2e+02 years)
1205C 2.8e+05Hrs (32 years)
1405C 2.8e+04Hrs (3.2 years)
1000
80
90
100
110
120
130
140
150
Degrees C Continous Tj
Figure 2. Estimated Wirebond Life
2
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