LMH6639_14 Datasheet, PDF (2/26 Pages) National Semiconductor (TI) – LMH6639 190MHz Rail-to-Rail Output Amplifier with Disable

LMH6639
SNOS989G – JANUARY 2002 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
ESD Tolerance
V_IN Differential
Input Current
Supply Voltage (V⁺ – V^−)
Voltage at Input/Output pins
Storage Temperature Range
Junction Temperature⁽⁵⁾⁽⁶⁾
Soldering Information
Infrared or Convection (20 sec)
Wave Soldering (10 sec)
2KV ⁽³⁾
200V ⁽⁴⁾
±2.5V
±10mA
13.5V
V⁺ +0.8V, V^− −0.8V
−65°C to +150°C
+150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Machine Model, 0Ω in series with 200pF.
(5) The maximum power dissipation is a function of T_J(MAX), θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ θ_JA . All numbers apply for packages soldered directly onto a PC board.
(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
Operating Ratings⁽¹⁾
Supply Voltage (V⁺ to V^−)
Operating Temperature Range⁽²⁾
Package Thermal Resistance (θ_JA)⁽²⁾
SOT-23-6
SOIC-8
3V to 12V
−40°C to +85°C
265°C/W
190°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ θ_JA . All numbers apply for packages soldered directly onto a PC board.
3V Electrical Characteristics
Unless otherwise specified, all limits ensured for at T_J = 25°C, V⁺ = 3V, V^− = 0V, V_O = V_CM = V⁺/2, and R_L = 2kΩ to V⁺/2.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min ⁽¹⁾
Typ ⁽²⁾
Max ⁽¹⁾
Units
BW
−3dB BW
BW_0.1dB
FPBW
0.1dB Gain Flatness
Full Power Bandwidth
A_V = +1
A_V = −1
R_F = 2.65kΩ , R_L = 1kΩ,
A_V = +1, V_OUT = 2V_PP, −1dB
V⁺ = 1.8V, V^− = 1.2V
120
170
63
16.4
21
MHz
MHz
MHz
GBW
e_n
Gain Bandwidth product
Input-Referred Voltage Noise
A_V = +1
R_F = 33kΩ
f = 10kHz
f = 1MHz
83
MHz
19
nV/√Hz
16
i_n
Input-Referred Current Noise
R_F = 1MΩ
f = 10kHz
f = 1MHz
1.30
pA/√Hz
0.36
THD
Total Harmonic Distortion
f = 5MHz, V_O = 2V_PP, A_V = +2,
R_L = 1kΩ to V⁺/2
−50
dBc
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
2
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