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LP3855-ADJ Datasheet, PDF (11/16 Pages) National Semiconductor (TI) – 1.5A Fast Response Ultra Low Dropout Linear Regulators
Application Hints (Continued)
If the maximum load current is 1.5A and a 10µF ceramic
input capacitor is used, the regulator will be stable with
ceramic output capacitor values from 10µF up to about
150µF. When calculating the total ceramic output capaci-
tance present in an application, it is necessary to include any
ceramic bypass capacitors connected to the regulator out-
put.
CFF (Feed Forward Capacitor)
The capacitor CFF is required to add phase lead and help
improve loop compensation. The correct amount of capaci-
tance depends on the value selected for R1 (see Typical
Application Circuit). The capacitor should be selected such
that the zero frequency as given by the equation shown
below is approximately 45 kHz:
Fz = 45,000 = 1 / ( 2 x π x R1 x CFF )
A good quality ceramic with X5R or X7R dielectric should be
used for this capacitor.
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and varia-
tion with temperature must be taken into consideration when
selecting a capacitor so that the minimum required amount
of capacitance is provided over the full operating tempera-
ture range. In general, a good Tantalum capacitor will show
very little capacitance variation with temperature, but a ce-
ramic may not be as good (depending on dielectric type).
Aluminum electrolytics also typically have large temperature
variation of capacitance value.
Equally important to consider is a capacitor’s ESR change
with temperature: this is not an issue with ceramics, as their
ESR is extremely low. However, it is very important in Tan-
talum and aluminum electrolytic capacitors. Both show in-
creasing ESR at colder temperatures, but the increase in
aluminum electrolytic capacitors is so severe they may not
be feasible for some applications (see Capacitor Character-
istics Section).
CAPACITOR CHARACTERISTICS
CERAMIC: For values of capacitance in the 10 to 100 µF
range, ceramics are usually larger and more costly than
tantalums but give superior AC performance for bypassing
high frequency noise because of very low ESR (typically less
than 10 mΩ). However, some dielectric types do not have
good capacitance characteristics as a function of voltage
and temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. A typical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half of
the rated voltage applied to it. The Z5U and Y5V also exhibit
a severe temperature effect, losing more than 50% of nomi-
nal capacitance at high and low limits of the temperature
range.
X7R and X5R dielectric ceramic capacitors are strongly rec-
ommended if ceramics are used, as they typically maintain a
capacitance range within ±20% of nominal over full operat-
ing ratings of temperature and voltage. Of course, they are
typically larger and more costly than Z5U/Y5U types for a
given voltage and capacitance.
TANTALUM: Solid Tantalum capacitors are typically recom-
mended for use on the output because their ESR is very
close to the ideal value required for loop compensation.
Tantalums also have good temperature stability: a good
quality Tantalum will typically show a capacitance value that
varies less than 10-15% across the full temperature range of
125˚C to −40˚C. ESR will vary only about 2X going from the
high to low temperature limits.
The increasing ESR at lower temperatures can cause oscil-
lations when marginal quality capacitors are used (if the ESR
of the capacitor is near the upper limit of the stability range at
room temperature).
ALUMINUM: This capacitor type offers the most capaci-
tance for the money. The disadvantages are that they are
larger in physical size, not widely available in surface mount,
and have poor AC performance (especially at higher fre-
quencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is
higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic can
exhibit an ESR increase of as much as 50X when going from
25˚C down to −40˚C.
It should also be noted that many aluminum electrolytics only
specify impedance at a frequency of 120 Hz, which indicates
they have poor high frequency performance. Only aluminum
electrolytics that have an impedance specified at a higher
frequency (between 20 kHz and 100 kHz) should be used for
the LP385X. Derating must be applied to the manufacturer’s
ESR specification, since it is typically only valid at room
temperature.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating tempera-
ture where ESR is maximum.
PCB LAYOUT
Good PC layout practices must be used or instability can be
induced because of ground loops and voltage drops. The
input and output capacitors must be directly connected to the
input, output, and ground pins of the LP385X using traces
which do not have other currents flowing in them (Kelvin
connect).
The best way to do this is to lay out CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins.
The regulator ground pin should be connected to the exter-
nal circuit ground so that the regulator and its capacitors
have a "single point ground".
It should be noted that stability problems have been seen in
applications where "vias" to an internal ground plane were
used at the ground points of the IC and the input and output
capacitors. This was caused by varying ground potentials at
these nodes resulting from current flowing through the
ground plane. Using a single point ground technique for the
regulator and it’s capacitors fixed the problem.
Since high current flows through the traces going into VIN
and coming from VOUT, Kelvin connect the capacitor leads to
these pins so there is no voltage drop in series with the input
and output capacitors.
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic
interference) can degrade any integrated circuit’s perfor-
mance because of the small dimensions of the geometries
inside the device. In applications where circuit sources are
present which generate signals with significant high fre-
quency energy content (> 1 MHz), care must be taken to
ensure that this does not affect the IC regulator.
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