LMV321_14 Datasheet, PDF (1/45 Pages) National Semiconductor (TI) – Low-Voltage Rail-To-Rail Output Operational Amplifiers

LMV321, LMV358
LMV324, LMV324S
www.ti.com
SLOS263V – AUGUST 1999 – REVISED DECEMBER 2013
Low-Voltage Rail-To-Rail Output Operational Amplifiers
Check for Samples: LMV321, LMV358, LMV324, LMV324S
FEATURES
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• 2.7-V and 5-V Performance
• –40°C to 125°C Operation
• Low-Power Shutdown Mode (LMV324S)
• No Crossover Distortion
• Low Supply Current
– LMV321 . . . 130 μA Typ
– LMV358 . . . 210 μA Typ
– LMV324 . . . 410 μA Typ
– LMV324S . . . 410 μA Typ
• Rail-to-Rail Output Swing
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
The LMV321, LMV358, and LMV324/LMV324S are
single, dual, and quad low-voltage (2.7 V to 5.5 V)
operational amplifiers with rail-to-rail output swing.
The LMV324S, which is a variation of the standard
LMV324, includes a power-saving shutdown feature
that reduces supply current to a maximum of 5 μA
per channel when the amplifiers are not needed.
Channels 1 and 2 together are put in shutdown, as
are channels 3 and 4. While in shutdown, the outputs
actively are pulled low.
The LMV321, LMV358, LMV324, and LMV324S are
the most cost-effective solutions for applications
where low-voltage operation, space saving, and low
cost are needed. These amplifiers are designed
specifically for low-voltage (2.7 V to 5 V) operation,
with performance specifications meeting or exceeding
the LM358 and LM324 devices that operate from 5 V
to 30 V. Additional features of the LMV3xx devices
are a common-mode input voltage range that
includes ground, 1-MHz unity-gain bandwidth, and 1-
V/μs slew rate.
The LMV321 is available in the ultra-small DCK (SC-
70) package, which is approximately one-half the size
of the DBV (SOT-23) package. This package saves
space on printed circuit boards and enables the
design of small portable electronic devices. It also
allows the designer to place the device closer to the
signal source to reduce noise pickup and increase
signal integrity.
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT 1
1IN– 2
1IN+ 3
V _{C C+} 4
2IN+ 5
2IN– 6
2OUT 7
14 4OUT
13 4IN–
12 4IN+
11 GND
10 3IN+
9 3IN–
8 3OUT
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT 1
1IN– 2
1IN+ 3
V_CC 4
2IN+ 5
2IN– 6
2OUT 7
1/2 SHDN 8
16 4OUT
15 4IN–
14 4IN+
13 GND
12 3IN+
11 3IN–
10 3OUT
9 3/4 SHDN
LMV358 . . . D (SOIC), DDU (VSSOP),
DGK (MSOP), OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT 1
1IN– 2
1IN+ 3
GND 4
8 VCC+
7 2OUT
6 2IN–
5 2IN+
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE
(TOP VIEW)
1IN+ 1
GND 2
1IN– 3
5 V_CC+
4 OUT
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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