LM4863MX Datasheet, PDF (1/2 Pages) National Semiconductor (TI) – Engineering Project Manager

Company
National Semiconductor
URL for Additional Information
http://www.national.com/quality/green/
Contact
Gloria Gordon
Title
Engineering Project Manager
Phone
1-408-721-8435
Email
[e-mail]
Part Number
LM4863MX
MSL Rating
2A
Peak Body Temp C
220
MaxTime (Sec)
30
Cycles
4
Document Date
3-Dec-2006
This part number contains Lead(Pb) and is NOT RoHS Compliant.
Weight (mg)
420.000
Unit Type
Each
Homogeneous Material Composition Declaration for Electronic Products
Item
Plastic
Leadframe
Ext. LeadFinish
Chip
Die Attach
Int. LeadFinish
Wires
Weight (mg) Component
305.050 SiO2
Epoxy Resin
Sb2O3
Brominated Epoxy
101.910 Cu
Fe
Zn
P
6.350 Sn
Pb
5.350 Si
Al
As (dopant)
B (dopant)
Ge (dopant)
P (dopant)
Sb (dopant)
0.570 Ag
Epoxy Resin
0.470 Ag
0.300 Au
CAS#
60676-86-0
25928-94-3
1309-64-4
40039-93-8
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-31-5
7439-92-1
7440-21-3
7429-90-5
7440-38-2
7440-42-8
7440-56-4
7723-14-0
7440-36-0
7440-22-4
25928-94-3
7440-22-4
7440-57-5
Weight (mg)
211.278
85.414
6.101
2.257
99.311
2.446
0.122
0.031
5.398
0.953
5.318
0.032
0.000
0.000
0.000
0.000
0.000
0.428
0.143
0.470
0.300
ppm
692,600
280,000
20,000
7,400
974,500
24,000
1,200
300
850,000
150,000
994,000
6,000
<1
<1
<1
<1
<1
750,000
250,000
1,000,000
1,000,000
Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical
testing. Additionally, the following should be noted:
1. One or more dopant materials may be present in the silicon die to provide semiconductor properties.The amounts are very small and estimated
as listed.
2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.
3. Brominated epoxy resins listed are generic and may or may not be the specific chemical used. The identity of the compound used is
proprietary, however National certifies that these brominated compounds are not PBB or PBDE's, which are banned.
4. The die attach, if present, does not contain any flame retardant.
National Semiconductor
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