CF5016 Datasheet, PDF (2/8 Pages) Nippon Precision Circuits Inc – 1.8V Operation Fundamental Frequency Crystal Oscillator Module ICs

PAD LAYOUT
(Unit: µm)
CF5016 series
VDD
HA
Y
5016
INHN
(720,680)
Q
VSS
(0,0) XT XTN
X
Chip size: 0.72 × 0.68mm
Chip thickness: 220 ± 30µm
PAD size: 90µm
Chip base: V_DD level
PIN DESCRIPTION and PAD DIMENSIONS
Name
INHN
XT
XTN
VSS
Q
VDD
I/O
Description
I
Output state control input. High impedance when LOW (oscillator stops).
Power-saving pull-up resistor built-in.
I
Amplifier input
O
Amplifier output
Crystal connection pins.
Crystal is connected between XT and XTN.
–
Ground
O
Output. Output frequency (f_O, f_O/2, f_O/4, f_O/8, f_O/16) determined by internal connection
–
Supply voltage
BLOCK DIAGRAM
Pad dimensions [µm]
X
Y
151
277
238
131
512
131
588
345
588
548
131
548
VDD VSS
XTN
CG
CD
Rf
XT
1/2 1/2 1/2 1/2
Q
INHN
INHN = LOW active
SEIKO NPC CORPORATION —2