CF5005B Datasheet, PDF (2/7 Pages) Nippon Precision Circuits Inc – High-frequency Crystal Oscillator Module ICs

PAD LAYOUT
(Unit: µm)
CF5005B series
VDD
Q _(920,1310)
Y
(0,0) _{INHN XTN}
XT VSS
X
Chip size: 0.92 × 1.31mm
Chip thickness: 300 ± 30µm
Chip base: V_DD level
PIN DESCRIPTION and PAD DIMENSIONS
Name
INHN
XT
XTN
VSS
Q
VDD
I/O
Description
I
Output state control input. Oscillator stops when LOW. Pull-up resistor built in
I
Amplifier input.
O
Amplifier output.
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XTN
–
Ground
O
Output. Output frequency (f_O). High impedance in standby mode
–
Supply voltage
Pad dimensions [µm]
X
Y
195
212
385
212
575
212
766
212
765
1152
162
1152
BLOCK DIAGRAM
VDD VSS
XTN
CG
CD
Rf 1 Cf
XT
Q
Rf 2
INHN
Substrate potential: V_DD
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