5087 Datasheet, PDF (1/15 Pages) Nippon Precision Circuits Inc – LVDS Output Oscillator ICs

5087 series
LVDS Output Oscillator ICs
OVERVIEW
The 5087 series are LVDS output oscillator ICs that operate with 300MHz to 700MHz SAW resonators. The series includes devices with
f₀/4 frequency output (mask option), making them ideal for low frequency SAW oscillators as low as 75MHz. They are specialized for
SAW oscillators, realizing smaller chip size compared to existing products. They feature low jitter, miniature LVDS output oscillator to use
in high-speed serial interface applications.
FEATURES
▪ 2.375 to 3.6V operating supply voltage range
▪ Recommended oscillation frequency range:
300MHz to 700MHz (varies with version)
▪ Output frequency range: 75MHz to 700MHz
f₀,f₀/2,f₀/4 output frequency, determined by internal connection
▪ Output rise time/Output fall time: 400ps (max)
▪ -40 to +85°C operating temperature range
▪ LVDS output
▪ Standby function
Outputs are high impedance when OE is LOW. (oscillator stops)
▪ Power-saving pull-up resistor built-in (OE pin)
▪ BiCMOS process
▪ Wafer form (WF5087xx)
▪ Chip form (CF5087xx)
SERIES CONFIGURATION
Version^*1
Recommended crystal
unit/resonator
Recommended oscillation
frequency range^*2[MHz]
Built-in capacitance^*3[pF]
C_XIN
C_XOUT
Output frequency
5087A1
f₀
5087A2
300 to 500
6
8
f₀/2
5087A3
SAW
f₀/4
5087B1
f₀
5087B2
500 to 700
5
5
f₀/2
5087B3
f₀/4
*1. It becomes WF5087xx in case of the wafer form and CF5087xx in case of the chip form.
*2. The recommended oscillation frequency is a yardstick value derived from the resonator used for NPC characteristics authentication. However, the
oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to resonator characteristics and mounting conditions, so
the oscillation characteristics of components must be carefully evaluated.
*3. The built-in oscillation capacitance contains parasitic capacitance.
ORDERING INFORMATION
Device
Package
WF5087xx-x
Wafer form
CF5087xx-x
Chip form
Form WF: Wafer form
CF: Chip (Die) form
Version name
WF5087□□-□
Wafer/Chip thickness 1: 300m
3:180m
Frequency divider function
Oscillation frequency range
SEIKO NPC CORPORATION - 1