5059H Datasheet, PDF (1/11 Pages) Nippon Precision Circuits Inc – 32kHz output Crystal Oscillator Module ICs

5059H series
32kHz output Crystal Oscillator Module ICs
OVERVIEW
The 5059H series are 32.768kHz output and 125°C operation crystal oscillator module ICs with divide-by-512 (or divide-by-1024)
frequency, AT-cut crystal 16.777216MHz (or 33.554432MHz) oscillator circuit built-in.
It is possible to generate a 32.768kHz output crystal oscillator with excellent temperature characteristics by using AT-cut crystal.
There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal oscillators.
FEATURES
▪ Wide range of operating supply voltage: 1.6 to 5.5V
▪ Oscillation frequency(fundamental oscillator):16.777216MHz or 33.554432MHz
▪ Output frequency: 32.768kHz (oscillation frequency divided by 512 or 1024)
▪ -40 to +125°C operating temperature range
▪ Regulated voltage drive oscillator circuit for reduced power consumption
and crystal drive current
▪ 3 pad layout options for mounting
5059HAx : for Flip Chip Bonding
5059HBx : for Wire Bonding(Type I)
5059HCx : for Wire Bonding(Type II)
▪ Oscillation capacitors C_G,C_D built-in
▪ Standby function
High impedance in standby mode, oscillator stops
▪ Power-saving pull-up resistor built-in
▪ ±1mA output drive capability (T_a=-40 to +85°C)
±0.8mA output drive capability (T_a=-40 to +125°C)
▪ 50±5% output duty (1/2VDD)
▪ Wafer form (WF5059Hxx)
▪ Chip form (CF5059Hxx)
APPLICATIONS
▪ 32.768kHz output crystal oscillator modules
SERIES CONFIGURATION
Version^*1
Oscillation frequency[MHz] ^{Oscillation capacitors*2[pF]}
（fundamental oscillator）
C_G
C_D
5059HAA
5059HBA
16.777216
3
2
5059HCA
5059HAB
5059HBB
33.554432
2
1
5059HCB
*1. It becomes WF5059Hxx in case of the wafer form and CF5059Hxx in case of the chip form.
*2. The oscillation capacitors do not contain parasitic capacitance.
Output
frequency[kHz]
32.768
(f_OSC/512)
32.768
(f_OSC/1024)
PAD layout
Flip Chip Bonding
Wire Bonding TypeⅠ
Wire Bonding TypeⅡ
Flip Chip Bonding
Wire Bonding TypeⅠ
Wire Bonding TypeⅡ
ORDERING INFORMATION
Device
Package
WF5059Hxx-4
Wafer form
CF5059Hxx-4
Chip form
Form WF:Wafer form
CF:Chip(Die) form
Version Name
WF5059H□□-4
Oscillation frequency A:16.777216MHz
B:33.554432MHz
PAD layout
A:For Flip Chip Bonding
B:For Wire Bonding(Type I)
C:For Wire Bonding(Type II)
SEIKO NPC CORPORATION - 1