5052H Datasheet, PDF (1/14 Pages) Nippon Precision Circuits Inc – Crystal Oscillator Module ICs

5052H series
Crystal Oscillator Module ICs
OVERVIEW
The 5052H series are miniature crystal oscillator module ICs supported 20MHz to 80 MHz fundamental oscillation mode and 125°C
operation. The Oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal drive current,
compared with existing devices, and significantly reducing the oscillator characteristics supply voltage dependency. There are 3 pad layout
package options available for optimized mounting, making these devices ideal for miniature crystal oscillators.
FEATURES
▪ Wide range of operating supply voltage: 1.60 to 3.63V
▪ Regulated voltage drive oscillator circuit for reduced
▪ Multi-stage frequency divider for low-frequency
output support: 1.25MHz (Hx1~Hx5 ver.)
power consumption and crystal drive current
2.5MHz (HxP~HxT ver.)
▪ Optimized low crystal drive current oscillation for
▪ Frequency divider built-in
miniature crystal units
▪ 3 pad layout options for mounting
Selectable by version: f_OSC,f_OSC/2,f_OSC/4,f_OSC/8,f_OSC/16
▪ Output drive capability: ±4mA
5052HAx: for Flip Chip Bonding
▪ -40 to 125°C operating temperature range
5052HBx: for Wire Bonding (Type I)
▪ Standby function
5052HCx: for Wire Bonding (Type II)
High impedance in standby mode, oscillator stops
▪ Recommended oscillation frequency range
(fundamental oscillator) :20 to 60MHz (Hx1~Hx5 ver.)
▪ CMOS output duty level (1/2V_DD)
▪ 50±5% output duty
40 to 80MHz (HxP~HxT ver.)
▪ 15pF output drive capability
▪ Wafer form (WF5052Hxx), Chip form (CF5052Hxx)
APPLICATIONS
▪ 3.2 x 2.5 , 2.5 x 2.0 , 2.0 x 1.6 size miniature crystal oscillator modules
SERIES CONFIGURATION
Operating supply
Oscillation frequency
voltage range[V]
PAD layout
range^*1 [MHz]
f_OSC
Output frequency and version name^*2
f_OSC/2
f_OSC/4
f_OSC/8
f_OSC/16
Flip Chip Bonding
20 to 60
40 to 80
5052HA1
5052HAP
5052HA2
5052HAQ
5052HA3
5052HAR
5052HA4
5052HAS
5052HA5
5052HAT
1.60 to 3.63
Wire Bonding
Type I
20 to 60
40 to 80
5052HB1
5052HBP
5052HB2
-
5052HB3
-
5052HB4
-
5052HB5
-
Wire Bonding
20 to 60
5052HC1
5052HC2
5052HC3
5052HC4
5052HC5
Type II
40 to 80
5052HCP
-
-
-
-
*1. The oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency
range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation
characteristics of components must be carefully evaluated.
*2. It becomes WF5052Hxx in case of the wafer form and CF5052Hxx in case of the chip form.
ORDERING INFORMATION
Device
Package
WF5052Hxx-5
Wafer form
CF5052Hxx-5
Chip form
Version name
WF5052H□□-5
Form WF : Wafer form
CF : Chip(Die) form
Frequency divider function/Oscillation frequency range
PAD layout A: for Flip Chip Bonding
B: for Wire Bonding (Type I)
C: for Wire Bonding (Type II)
SEIKO NPC CORPORATION - 1