SS312SAH4-R Datasheet, PDF (1/6 Pages) Nihon Kaiheiki Industry Co. Ltd. – Ultra-Miniature SMT Slides

Ultra-Miniature SMT Slides Series SS3
Distinctive Characteristics
Compact dimensions and low profile allow high density mounting and close stacking
of PC boards.
Crisp actuation positively indicates circuit status.
Heat resistant resin allows vapor phase and
infrared convection reflow soldering.
Award-winning STC mechanism with benefits
unavailable in conventional mechanisms:
smoother, positive detent actuation, increased
contact stability, and unparalleled logic-level
reliability. (Additional STC details in Terms
and Acronyms in the Supplement section.)
Insert molded terminals lock out flux, solvents, and other
contaminants.
Metric terminal spacing for standard PC board grid (2.0mm x 2.0mm ).
Gull-wing terminals provide mechanical stability during soldering and simplified
solder joint inspection.
Packaged in tape-reel or partitioned tray. Tape-reel packaging meets EIA-481-2 Standard.
Coplanarity: all considered surfaces must lie between two parallel planes that are a maximum
distance apart of .0059” (0.15mm). (Additional coplanarity details in Terms and Acronyms in
the Supplement section.)
Actual Size
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