EC11FS2 Datasheet, PDF (1/2 Pages) Nihon Inter Electronics Corporation – FRD LOW POWER LOSS, HIGH EFFICIENCY

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FRD Type : EC11FS2
FEATURES
* Miniature Size,Surface Mount Device
* Ultra-Fast Recovery
* Low Forward Voltage Drop
* Low Power Loss, High Efficiency
* High Surge Capability
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
OUTLINE DRAWING
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Maximum Ratings
Approx Net Weight:0.06g
Rating
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified Output Current
RMS Forward Current
Surge Forward Current
Operating JunctionTemperature Range
Storage Temperature Range
Symbol
VRRM
VRSM
IO
IF(RMS)
IFSM
Tjw
Tstg
EC11FS2
200
220
0.81 Ta=25°C *1
1.0 Ta=34°C *2
50Hz Half Sine
Wave Resistive Load
1.57
20
50Hz Half Sine Wave,1cycle
Non-repetitive
-40 to +150
-40 to +150
Unit
V
V
A
A
A
°C
°C
Electrical • Thermal Characteristics
Characteristics
Symbol
Conditions
Min.
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time
Thermal Resistance
IRM Tj= 25°C, VRM= VRRM
-
VFM Tj= 25°C, IFM= 1.0A
-
trr IFM= 1A, -di/dt= 50A/µs, Ta= 25°C -
Rth(j-a) Junction to Ambient
*1
-
*2
-
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
Typ.
-
-
-
-
-
Max.
10
0.98
30
157
108
Unit
µA
V
ns
°C /W
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