NT2W757GR Datasheet, PDF (7/23 Pages) NICHIA CORPORATION – Built-in ESD Protection Device

SOLDERING
NICHIA STS-DA1-3938 <Cat.No.150819>
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
260°CMax
10sec Max
• Recommended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
120sec Max
● Recommended Soldering Pad Pattern
● Recommended Metal Solder Stencil Aperture
0.85
2.3
0.85
0.6
1.53
0.69
0.6
0.58
0.6
1.45 0.95
0.6
0.4
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle
with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface
and may also cause the LED not to illuminate.
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