NS9W383 Datasheet, PDF (7/24 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR WHITE LED

SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
260°CMax
10sec Max
● Recommended Soldering Pad Pattern
8
4.6
2.38
NICHIA STS-DA1-2717B <Cat.No.130726>
Cathode
Anode
(単位 Unit: mm)
Die Heat Sink and the cathode should be soldered to a PCB.
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
Using a nozzle designed for the LEDs is recommended. (See Figure below)
* The nozzle must not have any direct contact with the encapsulating resin.
Direct contact with the encapsulating resin may result in internal disconnections causing the LED not to illuminate.
5.3
(6.3)
(単位 Unit: mm)
6