NSSM032A_15 Datasheet, PDF (6/17 Pages) NICHIA CORPORATION – Pb-free Reflow Soldering Application

SOLDERING
NICHIA STS-DA1-3916 <Cat.No.150831>
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
260°CMax
10sec Max
• Recommended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
120sec Max
● Recommended Soldering Pad Pattern
1.55
2.9
1.55
6
(単位 Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* If the LEDs are reflowed a second time, it is recommended to perform the second soldering as soon as the LEDs have cooled down
to room temperature naturally after the first soldering in order to avoid moisture absorption.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product.
* This product can differ in optical characteristics depending on both the number of reflow cycles and reflow temperature conditions.
In a single display, only LEDs with both the same number of reflow cycles and reflow temperature conditions
should be used regardless of the application type (e.g. rental and/or permanent installations).
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
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