NSPE510S Datasheet, PDF (6/15 Pages) NICHIA CORPORATION – BLUISH-GREEN LED

Nichia STSE-CE2173B
<Cat.No.031128>
(4) Soldering Conditions
· Nichia BG-LED leadframes are comprised of a silver plated copper alloy. This substance has a low
thermal coefficient (easily conducts heat). Careful attention should be paid during soldering.
· Solder the BG-LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base
of the tie bar is recommended.
· Recommended soldering conditions
Dip Soldering
Soldering
Pre-Heat
120°C Max.
Temperature
350°C Max.
Pre-Heat Time 60 seconds Max.
Soldering Time 3 seconds Max.
Solder Bath
260°C Max.
Position
No closer than 3 mm from the
Temperature
base of the epoxy bulb.
Dipping Time 10 seconds Max.
Dipping Position No lower than 3 mm from the
base of the epoxy bulb.
· Do not apply any stress to the lead particularly when heated.
· The BG-LEDs must not be repositioned after soldering.
· After soldering the BG-LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the BG-LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes. When it is
absolutely necessary, the BG-LEDs may be mounted in this fashion but the User will assume
responsibility for any problems. Direct soldering should only be done after testing has confirmed that
no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s BG-LEDs should not
be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the BG-LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the BG-LEDs.
· Cut the BG-LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause failure of the BG-LEDs.
(5) Heat Generation
· Thermal design of the end product is of paramount importance. Please consider the heat generation
of the BG-LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of BG-LED
placement on the board, as well as other components. It is necessary to avoid intense heat generation
and operate within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of BG-LEDs.
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the BG-LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not. Freon solvents should not be used to clean the BG-LEDs because of worldwide regulations.
· Do not clean the BG-LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the BG-LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the BG-LEDs will occur.
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