NS6G083T Datasheet, PDF (6/14 Pages) NICHIA CORPORATION – TYPE GREEN LED

Nichia STSE-CC7085A
<Cat.No.070608>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
Pre-heat time
Peak
temperature
120 ~ 150°C
120 sec. Max.
240°C Max.
180 ~ 200°C
120 sec. Max.
260°C Max.
Temperature 350°C Max.
Soldering time 3 sec. Max.
(one time only)
Soldering time _{10 sec. Max.}
10 sec. Max.
Condition
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N₂ reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
240°C Max.
1 ~ 5°C / sec.
260°C Max.
2.5 ~ 5°C / sec.
Pre-heating
10sec. Max.
120 ~ 150°C _60sec.Max.
Above 200°C
1 ~ 5°C / sec.
Pre-heating
10sec. Max.
180 ~ 200°C _60sec.Max.
Above 220°C
120sec.Max.
[Recommended soldering pad design]
Thin line boxes：Solder resist opening
Thick line boxes：Land pattern
Make sure the die heat sink is electrically
connected to the cathode(K).
120sec.Max.
Use the following conditions shown in the figure.
(9.5)
Die Heat Sink
2.05
1.05
K
1.1
A
4.5
8
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered. If not, please use the heat conductive adhesive.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
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