NSCWJ216A Datasheet, PDF (20/21 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR WHITE LED

NICHIA STS-DA1-2685B <Cat.No.130613>
(4) Design Consideration
● Excessive forces on this product can cause the ceramic package to crack.
It is recommended to use a holder when fixing this product to a chassis.
● It is recommended to use a thermal film or thermal grease between the product and a chassis for increased heat dissipation.
(5) Electrostatic Discharge (ESD)
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Eliminating the charge
Grounded wrist strap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
● Ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and
that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs,
protection against surge voltages should also be used.
● If tools or equipment contain insulating materials such as glass or plastic,
the following measures against electrostatic discharge are strongly recommended:
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
(6) Thermal Management
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
by LED module thermal resistance and LED spacing. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (T_J).
● The dice temperature of the products should be calculated, using the case temperature (T_C) of the product incorporated
into the end-product, by the following equation.
T_J=T_C+R_θJC･W
*T_J=LED junction temperature: °C
T_C=Case temperature: °C
R_θJC=Thermal resistance from junction to T_C measuring point: °C/W
W=Input power(I_F×V_F): W
Tc Point
(7) Cleaning
● The LEDs should not be cleaned with water, benzine, and/or thinner.
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
● When dust and/or dirt adheres to the LEDs, soak a cloth with Isopropyl alcohol (IPA), then squeeze it before wiping the LEDs.
● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs
depending on the ultrasonic power and how LED is assembled.
If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning.
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