NSPU Datasheet, PDF (2/2 Pages) NIC-Components Corp. – Stacked Film Capacitor Chips

Stacked Film Capacitor Chips
NSPU Series
STANDARD VALUES AND CASE SIZES (mm)
Part Number
NSPU104M16TRA3F
NSPU154M16TRB4F
NSPU224M16TRB4F
NSPU334M16TRB5F
NSPU474M16TRB6F
NSPU684M16TRB6F
NSPU105M16TRC4F
Capacitance Value
0.1μF
0.15μF
0.22μF
0.33μF
0.47μF
0.68μF
1.0μF
L ± 0.2
2.0
3.2
Stacked Element Terminations: 95.5% Sn, 4% Ag and
0.5% Cu over phenolic
resin/Ag/Ni/Cu barrier over
Cu base.
H
Dimensions (mm)
W ± 0.2
H ± 0.2
1.25
1.0
0.8
0.8
1.6
1.0
1.4
1.4
2.5
1.4
P
0.45 ± 0.25
0.65 ± 0.30
EIA
Size
0805
1206
1206
1206
1206
1206
1210
Reel
Qty
3,000
3,000
3,000
3,000
2,000
2,000
2,000
LAND PATTERN DIMENSIONS (mm)
EIA Size A ± 0.1 B ± 0.1 C ± 0.2
0805
1.55
2.3
1.3
1206
1.9
3.5
1.5
1210
1.9
3.5
1.9
p
L₂
p
W
RECOMMENDED REFLOW PROFILE
A
L₁
B
300
250
Peak Temperature
240°C
200
150
Cool Down
100
Time above 220°C
50
30 sec. max.
25
Ramp-up
25°C ~ 150°C
0
90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Time
Note: These capacitors are sensitive to moisture. Capacitors should be stored in moisture barrier packaging at
+25°C and a relative humidity of <70% (six months maximum). The components should be soldered within 72
hours of breaking the moisture barrier packaging seal and stored during those 72 hours at <+25°C and <70%
relative humidity. If the parts are to be storage outside of the moisture barrier packaging the conditions should
be <+20°C and relative humidity of less then 50%.
TAPE AND REEL DIMENSIONS (mm)
Case Code
A3
B4, B5
B6
C4
A ± 0.1
1.55
1.9
1.9
2.8
B ± 0.1
2.3
3.5
3.5
3.5
C ± 0.2
1.3
1.5
1.9
1.9
t ± 0.05
0.25
W ± 0.3 F ± 0.05
8.0
3.5
P ± 0.1 D +0.2/-0
4.0
1.0
REEL
13.0 _{+/− 0.5}
2.0 +/− 0.5
2.0 +/- 0.5
1.5 +0.1
-0
4.0 ±0.1
P₁
1.75 ±0.1
t
D2
®
NIC COMPONENTS CORP.
t
A
W
www.niccomp.com www.lowESR.com
B
D
o
P
www.RFpassives.com
F
W
C
www.SMTmagnetics.com
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